Electronic component cover and arrangement

ABSTRACT

An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.

RELATED APPLICATIONS

This application is a continuation of co-pending U.S. patent applicationSer. No. 11/768,166 filed on Jun. 25, 2007, which is hereby incorporatedin its entirety for all purposes.

BACKGROUND OF THE INVENTION

The present invention relates generally to the field of electronicdevices and, more particularly, to arrangements for electronic componentcovers in such devices.

Many electronic devices, such as laptop computers, are provided withvarious electronic components, such as an embedded wireless modem toallow the devices to communicate with networks or other devices. Suchelectronic components often require coupling to other electroniccomponents within the devices for proper operation. For example,communication via a wireless modem can often require security featureswhich require the electronic device to identify itself or the user tothe network or other device. Often, this is achieved by a subscriberidentity module (SIM) card provided on the communication device. The SIMcard may include identification data for one or more users and/or thedevice.

FIG. 1 illustrates a conventional communication device 10 having anembedded wireless modem 12 and a SIM card 14. Due to lack of space nearthe modem 12, the SIM card 14 is typically positioned remotely from themodem 12 in the device 10. This remote location of the SIM card 14 hasthe disadvantage of requiring an electrical connection 16 to enableinterfacing of the modem 12 and the SIM card 14.

SUMMARY OF THE INVENTION

One aspect of the invention relates to an electronic component covercomprising a plate having a first region adapted to substantially coverat least one side of a first electronic component. The plate is adaptedto accommodate a second electronic component thereon.

In one embodiment, the first electronic component is a modem and thesecond electronic component is a memory card or a memory card reader.

In one embodiment, the plate forms a shield.

In one embodiment, the plate includes a second region to accommodate thesecond electronic component therein. The second region may include tabsto secure the second electronic component therein. The tabs may beadapted to removably secure the second electronic component in thesecond region.

In another embodiment, the second region is adapted to accommodate thesecond electronic component on an inside of the plate.

The first region and the second region may be adapted to allow anelectrical coupling of the first electronic component and the secondelectronic component.

In one embodiment, the modem shield further comprises one or more tabsadapted to secure the plate to a board on which the first electroniccomponent is adapted to be mounted.

The plate may be formed of tin-plated steel.

In one embodiment, the electronic component cover further comprises oneor more leads adapted to provide electrical communication between thefirst electronic component and the second electronic component. The oneor more leads are electrically isolated from the plate. In oneembodiment, the plate is formed of a polymer material and the one ormore leads are etched onto the polymer material. In a particularembodiment, the electronic component cover further comprises anonconductive mount adapted to accommodate the second electroniccomponent thereon. The nonconductive mount secures the one or more leadsto the plate while electrically isolating the one or more leads from theplate. The nonconductive mount may be formed of a plastic.

In another aspect of the invention, an electronic component arrangementcomprises a first electronic component adapted to be mounted on acircuit board and a cover having a first region substantially coveringat least one side of the first electronic component, the cover beingadapted to accommodate a second electronic component thereon.

In another aspect, the invention includes an electronic componentarrangement comprising a first electronic component adapted to bemounted on a circuit board, a cover and a second electronic component.The cover has a first region substantially covering at least one side ofthe first electronic component. The second electronic component ispositioned upon the cover.

In another aspect of the invention, a communication device comprises anelectronic component arrangement. The electronic component arrangementcomprises a first electronic component adapted to be mounted on acircuit board, a cover and a second electronic component. The cover hasa first region substantially covering at least one side of the firstelectronic component. The second electronic component is positioned uponthe cover.

In one embodiment, the second electronic component is a SIM card.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an exemplary prior art electronic componentarrangement in a device;

FIG. 2 illustrates an exemplary cover for an electronic component;

FIG. 3 illustrates an embodiment of an electronic component coveraccording to an embodiment of the present invention;

FIG. 4 illustrates another embodiment of an electronic component coveraccording to an embodiment of the present invention; and

FIGS. 5A-5D illustrate the formation of an electronic component coverarrangement according to an embodiment of the present invention.

DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS

Embodiments of the present invention take advantage of space oftenwasted in the region of a first electronic component, such as anembedded modem. Such wasted space can be adapted to accommodate a secondelectronic component, such as a SIM card or a SIM card reader.

FIG. 2 illustrates an electronic component cover 20, such as a modemshield found around many embedded modems to provide protection for themodems. The electronic component cover 20 is adapted to substantiallysurround a first electronic component, such as a modem, installed on acommunication device. In this regard, the electronic component cover 20includes a top surface 22 which covers the first electronic componentand side legs 24 which can secure the electronic component cover 20 to aboard on which the first electronic component is mounted. Thus, theelectronic component cover 20 is secured to the board whilesubstantially surrounding the first electronic component, which can beaccommodated in a region 26 formed by the top surface 22 and the sidelegs 24.

As illustrated in FIG. 2, the top surface 22 of the electronic componentcover 20 is a flat surface. However, electronic components are often notflat. Thus, empty space typically exists between the electroniccomponent cover 20 and the first electronic component. In accordancewith embodiments of the invention described below, this empty space canbe utilized to form an electronic component cover adapted to accommodatea second electronic component. For example, in one embodiment, theelectronic component cover 20 is a shield for a wireless modem, and theempty space can be adapted to accommodate a SIM card, a SIM card readeror both.

FIG. 3 illustrates an electronic component cover in accordance with anembodiment of the present invention. The electronic component cover 30is in the form of a plate formed of a variety of materials. In aparticular embodiment, the electronic component cover is formedgenerally of tin-plated steel.

The electronic component cover includes a top surface 32 and side legs34 forming a first region 36 (under the top surface 32) to accommodate afirst electronic component (not shown), such as an embedded modem.

The embodiment of the electronic component cover illustrated in FIG. 3includes a second region 37 formed on the outside of the electroniccomponent cover 30. The second region 37 is sized and shaped toaccommodate a second electronic component, such as a SIM card (notshown), therein. The first electronic component housed is the firstregion 36 and the second electronic component housed in the secondregion 37 may include any number of electronic components. As notedabove, in one embodiment, a wireless modem may be housed in the firstregion 36, and a SIM card reader may be accommodated in the secondregion. The SIM card and the modem may be of any type, such as inaccordance with certain standards, for example. In embodiments of thepresent invention, the first and second electronic components mayinclude (1) active circuitry, such as SIM cards, memory cards, otherintegrated circuits and modems, (2) passive circuitry such as filters,resistors, capacitors and inductors, (3) antennas, (4) electrical ormechanical devices such as switches, LED's, displays, heat sinks,speakers and fans, and (5) power sources such as batteries. In oneembodiment, the first or second electronic component may include activecircuitry forming a Bluetooth-capable card adapted to receive ortransmit Bluetooth signals.

The electronic component cover 30 may be adapted to be snapped onto aprinted circuit board. For example, the side legs 34 (or tabs thereon)of the electronic component cover 30 may snap into slots formed on theprinted circuit board such that the electronic component cover 30 coversthe first electronic component mounted on the printed circuit board.Thus, the electronic component cover 30 may be removably attached to aprinted circuit board. Alternatively, the electronic component cover 30may be irremovably fastened to the printed circuit board, such as bysoldering.

A second electronic component, such as a SIM card or SIM card reader,may be positioned on the electronic component cover 30 within the secondregion 37 by sliding through an entry 37 a of the second region 37. Tabs38 are provided on the edges of the second region 37 to secure thesecond electronic component within the second region 37. In oneembodiment, the tabs 38 may be adapted to removably secure the secondelectronic component in the second region. Thus, when desired by a user,the second electronic component may be removed by sliding it through theentry 37 a.

The electronic component cover 30 is provided with an opening 39 toallow electrical coupling or communication between the second electroniccomponent in the second region 37 and the first electronic component inthe first region 36. In this regard, electrical contacts may be providedon the first electronic component such that they are accessible throughthe opening 39. Corresponding contacts may be provided on the secondelectronic component such that electrical communication between thefirst and second electronic components is made available when the secondelectronic component is positioned in the second region.

In the embodiment illustrated in FIG. 3, while the first electroniccomponent is inside the electronic component cover 30, the secondelectronic component is positioned in the second region 37 on theoutside of the electronic component cover. In another embodiment, thesecond region 37 may be formed such that the second electronic componentis also positioned on an inside of the electronic component cover 30.One such embodiment is illustrated in FIG. 4.

The electronic component cover 40 illustrated in FIG. 4 is similar tothat illustrated in FIG. 3 and includes a top surface 42 and side legs44 forming a first region 46. In the embodiment illustrated in FIG. 4, asecond region 47 is formed such that the second electronic component maybe accommodated on the inside of the electronic component cover 40.Thus, the top surface 42 of the electronic component cover 40 may be aflat surface with tabs 48 extending underneath the top surface 42 of theelectronic component cover 40. The second electronic component may bepositioned in the second region 47 by sliding the second electroniccomponent through an entry 47 a of the second region 47.

As noted above, in some embodiments, the electronic component cover maybe adapted to allow electrical communication between the first andsecond electronic components. While some embodiments may include anopening to allow such electrical communication, other embodiments, asillustrated in FIGS. 5A-5D, may provide leads to enable suchcommunication.

FIGS. 5A-5D illustrate the process of forming an electronic componentcover and arrangement in accordance with embodiments of the presentinvention. Referring first to FIG. 5A, a template for an electroniccomponent cover may be formed by any of various known methods, such asby stamping a metal sheet into the desired form. The electroniccomponent cover 50 includes a top surface 52 and side legs 54 forming afirst region 56 adapted to accommodate a first electronic component,such as an embedded modem. A second region 57 is provided on the topsurface to accommodate a second electronic component, such as a SIM cardreader. The top surface 52 is provided with cut-outs for leads 58, aswell as lead ends 59 extending downward toward the first electroniccomponent or the printed circuit board.

Referring now to FIG. 5B, the electronic component cover 50 of FIG. 5Ais illustrated with a nonconductive mount 60 formed in at least thesecond region 57. The nonconductive mount 60 may be formed of a plasticand may be formed by, for example, molding the plastic around the leads58. In one embodiment, this is achieved by an “insert molding” processin which the stamped metal is positioned within a molding tool, and theplastic is formed around the stamped metal by injection molding. In thisregard, the nonconductive mount 60 is formed to cover selected regionsof the leads 58 while desired portions of the leads 58 are left exposed.

In one embodiment, the nonconductive mount 60 is formed of ahigh-temperature plastic, such Amodel® available from the SolvayAdvanced Polymers. Use of a high-temperature plastic allows theelectronic component cover 50 to go through the high temperatures of asurface mount line. This, in turn, allows soldering in line of theelectronic component cover 50 to, for example, a printed circuit board.

Referring now to FIG. 5C, the leads 58 are cut such that the leads 58and the lead ends 59 are electrically isolated from the top surface 52of the electronic component cover 50. The leads 58 may be cut using anyof a number of known methods. In one embodiment, a laser-cut methodusing a CO2 laser is employed to achieve the desired result. In anotherembodiment, the stamped electronic component cover 50 shown in FIG. 5Amay be provided with thinned-out portions corresponding to the locationsto be cut. Thus, a stamping die may be used to break the leads 58 at thethinned-out locations.

Referring now to FIG. 5D, an arrangement is illustrated with a SIM cardreader 70 (with a SIM card 70 a positioned therein) positioned on theelectronic component cover 50. The SIM card 70 is positioned on thenonconductive mount 60. The SIM card reader 70 may be secured to thenonconductive mount 60 and the electronic component cover 50 by way ofsoldering.

With the SIM card reader 70 properly positioned, connectors of the SIMcard reader 70 become in contact with the leads 58, which allowelectrical communication with the first electronic component (e.g., amodem) in the first region 56 or the printed circuit board 71 throughthe lead ends 59. The assembly including the printed circuit board 71,the modem and the SIM card reader 70 may be connected to a communicationdevice by way of, for example, a universal serial bus (USB) connector.

In another embodiment, the electronic component cover 60 is formed of apolymer material, and the leads 58, 59 are formed by etching metalplating onto the polymer material. In such a configuration, thenonconductive mount 60 may not be required.

In another embodiment, the second component is an antenna embedded inthe nonconductive mount 60. In this regard, the antenna may be held in adesired position during an “insert molding” process. Thus, the antennais positioned within the insulated nonconductive mount 60.

Thus, with embodiments of the present invention, the SIM card 70 or anyother second electronic component can be positioned directly andproximate to the first electronic component (such as a modem).

While particular embodiments of the present invention have beendisclosed, it is to be understood that various different modificationsand combinations are possible and are contemplated within the truespirit and scope of the appended claims. There is no intention,therefore, of limitations to the exact abstract and disclosure hereinpresented.

1. An electronic component cover, comprising: a plate having a firstregion adapted to substantially cover at least one side of a firstelectronic component; the plate being adapted to accommodate a secondelectronic component thereon; and one or more leads adapted to provideelectrical communication between the first electronic component and thesecond electronic component; wherein the one or more leads areelectrically isolated from the plate.
 2. The electronic component coverof claim 1, wherein the first electronic component is a modem and thesecond electronic component is a memory card or a memory card reader. 3.The electronic component cover of claim 1, wherein the first electroniccomponent or the second electronic component includes at least one ofthe following: (1) active circuitry, (2) passive circuitry, (3) anantenna, (4) an electrical or mechanical device, or (5) a power source.4. The electronic component cover of claim 1, wherein the plate forms ashield.
 5. The electronic component cover of claim 1, wherein the plateis formed of tin-plated steel.
 6. The electronic component cover ofclaim 1, wherein the plate is formed of a polymer material and the oneor more leads are etched onto the polymer material.
 7. The electroniccomponent cover of claim 1, further comprising: a nonconductive mountadapted to accommodate the second electronic component thereon; whereinthe nonconductive mount secures the one or more leads to the plate whileelectrically isolating the one or more leads from the plate.
 8. Theelectronic component cover of claim 7, wherein the second electroniccomponent is an antenna embedded in the nonconductive mount.
 9. Theelectronic component cover of claim 7, wherein the nonconductive mountis formed of a plastic.
 10. An electronic component arrangement,comprising: a first electronic component adapted to be mounted on acircuit board; a cover having a first region substantially covering atleast one side of the first electronic component, the cover beingadapted to accommodate a second electronic component thereon; and one ormore leads adapted to provide electrical communication between the firstelectronic component and the second electronic component; wherein theone or more leads are electrically isolated from the cover.
 11. Theelectronic component arrangement of claim 10, wherein the cover isformed of a polymer material and the one or more leads are etched ontothe polymer material.
 12. The electronic component arrangement of claim10, further comprising: a nonconductive mount adapted to accommodate thesecond electronic component thereon; wherein the nonconductive mountsecures the one or more leads to the cover while electrically isolatingthe one or more leads from the cover.
 13. The electronic componentarrangement of claim 10, wherein the second electronic component is anantenna embedded in the nonconductive mount.
 14. The electroniccomponent arrangement of claim 10, wherein the nonconductive mount isformed of a plastic.
 15. An electronic component arrangement,comprising: a first electronic component adapted to be mounted on acircuit board; a cover having a first region substantially covering atleast one side of the first electronic component; a second electroniccomponent positioned upon the cover; and one or more leads adapted toprovide electrical communication between the first electronic componentand the second electronic component; wherein the one or more leads areelectrically isolated from the cover.
 16. The electronic componentarrangement of claim 15, wherein the cover is formed of a polymermaterial and the one or more leads are etched onto the polymer material.17. The electronic component arrangement of claim 15, furthercomprising: a nonconductive mount accommodating the second electroniccomponent thereon; wherein the nonconductive mount secures the one ormore leads to the cover while electrically isolating the one or moreleads from the cover.
 18. The electronic component arrangement of claim15, wherein the second electronic component is an antenna embedded inthe nonconductive mount.
 19. The electronic component arrangement ofclaim 15, wherein the nonconductive mount is formed of a plastic.